SCOPE
Data Science, as a highly interdisciplinary field, is playing a more and more critical and central role in the development of cyberspace and various applications. Data science in cyberspace is an integral part of competitive intelligence, a newly emerging field that encompasses a number of activities, such as data mining and data analysis. Data science in cyberspace inspires novel techniques and theories drawn from many areas, such as mathematics, statistics, information theory, computer science, and social science, and involves many specific domains, such as signal processing, probability models, machine learning, statistical learning, data mining, database, data engineering, pattern recognition and learning, visualization, predictive analytics, uncertainty modeling, data warehousing, data compression, computer programming, and high performance computing.
You can download Call for Papers from here.
CONFERENCE AREAS
The IEEE International Conference on Data Science in Cyberspace (IEEE DSC) will bring together researchers and practitioners in the field of data science. IEEE DSC 2017 invites submissions on a wide spectrum of topics, including but not limited to the following areas:
1. Data Science
2. Big Data
3. Data Intensive Applications in Cyberspace
4. Data Intensive Systems
5. Social Networks & Social Media
6. Data Mining, Knowledge Discovery and Machine Learning
7. Information Retrieval and Smart Search
8. Cyberspace Security
9. Network Wisdom
10. Data Security and Privacy
WORKSHOPS
We also host a set of workshops as follows:
1. Big Data and Business Analytics (BDBA)
2. Big Data Cybersecurity Analytics (BDCA)
3. Cyber-Physical Systems Security & Privacy (CPSSP)
4. Data Security and Privacy in Internet of Things (DSPIoT)
5. Data Systems Security (DSS)
6. Data Science and Web Analytics (DSWA)
7. Data Visualization (DV)
8. Multi-view Network Fusion and Analysis (MuNFA)
9. Privacy for Big Data (PBD)
PAPER SUBMISSION
All submissions should be written in English and submitted via our submission system: http://www.ieee-dsc.org/2017/submission.html. A paper submitted to IEEE DSC 2017 cannot be under review for any other conference or journal during the entire period that it is considered for IEEE DSC 2017, and must be substantially different from any previously published work. Submissions are reviewed in a single-blind manner.
Please note that all submissions must strictly adhere to the IEEE templates as provided below. The templates also act as a guideline regarding formatting. In particular, all submissions must use either the LATEXtemplate or the MS-Word template. Please follow exactly the instructions below to ensure that your submission can ultimately be included in the proceedings.
TEMPLATES
Using these templates is strongly advised to all authors submitting a paper for reviewing and mandatory for those uploading the camera-ready version of their papers. Failure to produce correctly formatted camera-ready submissions may result in the paper’s exclusion from the Proceedings.
LATEX Archive Contents
LATEX Bibliography Files
PUBLICATIONS
Accepted and presented papers (including main conference and workshops papers) will be published in the IEEE DSC 2017 conference proceedings and submitted to both EI Compendex and IEEE Xplore®. Best papers from the conference proceedings will be selected by the board for follow-up fast-tracked journal publication in some well-known SCI-indexed journals, including International Journal of Machine Learning and Cybernetics, IEEE IoT Journal (IoT-J), and Chinese Journal of Electronics (CJE), etc. Follow-up work is required based on each journal’s policy.
IMPORTANT DATES
Full paper due:
Acceptance notification:
Camera-ready copy:
Conference Date: June 26-29, 2017
WORKSHOP, PANELS, TUTORIALS, INDUSTRY PRESENTATIONS
In addition to technical contributions, IEEE DSC 2017 invites proposals for panels, workshops, tutorials, industry presentations. For workshops, DSC will provide administrative support for workshop room booking, registration, and publication. All papers accepted by DSC workshops will be published in a combined volume of DSC proceedings. Proposals or industry papers should be sent as e-mail attachments to [email protected].